PECVD

ideal für thermisch empfindliche Substrate

Plasma Enhanced Chemical Vapor Deposition (PECVD) is an established process for depositing reactive thin films from the gas phase—even at relatively low substrate temperatures. A plasma activates the process gases, generating highly reactive species that form dense, functional layers on the substrate surface.

PECVD is especially well-suited for thermally sensitive substrates, such as those used in packaging or display applications. The resulting coatings can serve a wide range of functions, including diffusion barriers, anti-reflective layers, and hydrophobic or oleophobic surfaces.

This technology is scalable, stable, and easy to integrate into roll-to-roll vacuum systems—making it ideal for large-area industrial applications.