Magnetron sputtering is one of the most widely used PVD technologies for depositing thin films with exceptional precision, uniformity, and adhesion. In this vacuum-based process, a solid target material is bombarded by ionized gas particles (plasma), causing atoms to be ejected from the target and deposited onto a substrate.
A magnetic field enhances the plasma density near the target surface, increasing deposition efficiency and process stability. The result is a highly controlled and reproducible coating process, suitable for a wide range of metals, alloys, and ceramics.
Depending on the application, planar or cylindrical targets are used, which can be scaled to match the substrate width. The process can be configured for dynamic (in-line) or static coating modes, making it ideal for everything from research and prototyping to large-area industrial production.
At HS Group, we design and manufacture our own magnetrons, incorporating decades of engineering experience and process expertise into every component. This allows us to offer tailored sputtering solutions optimized for performance, reliability, and scalability.
