Plasma Enhanced Chemical Vapor Deposition (PECVD) is an established process for depositing reactive thin films from the gas phase—even at relatively low substrate temperatures. A plasma activates the process gases, generating highly reactive species that form dense, functional layers on the substrate surface.
PECVD is especially well-suited for thermally sensitive substrates, such as those used in packaging or display applications. The resulting coatings can serve a wide range of functions, including diffusion barriers, anti-reflective layers, and hydrophobic or oleophobic surfaces.
This technology is scalable, stable, and easy to integrate into roll-to-roll vacuum systems—making it ideal for large-area industrial applications.
Gentle deposition on heat-sensitive substrates like polymers and films
Suitable for barrier layers, optical functions, and surface modification
High reproducibility from lab setups to full-scale production
San Francisco, CA, USA
Moscone Center
North Hall | Booth 5373
Porschestrasse 12
63512 Hainburg
Germany
