The sputter deposition systems of the SEMILINE series have been specially developed for high-throughput production environments. They feature a high-capacity load-lock chamber to meet almost any requirement in thin film coating.
High throughput
The fast-cycle load-lock chamber, the high vacuum pump (turbo or cryo), and the Meissner trap enable rapid processing of batch loads. High throughput is achieved with a wide variety of substrates.
High yield
A rotating substrate platter for multiple coatings ensures high uniformity and repeatability from batch to batch. The simple mechanical design with few moving parts in the process chamber minimizes the generation of defect-causing particles. User-friendly pallet designs reduce the risk of wafer breakage. Clean vacuum conditions ensure reproducibly high-quality layers.
Optimal process control
The SEMILINE series offers a wide selection of target materials, operating modes, pressure and gas controls, cathode configurations, and power levels. Supported operating modes: DC magnetron, RF magnetron, RF diode, bias sputtering, reactive sputtering, co-sputtering, as well as RF etching.
Complete control over critical layer properties
The SEMILINE series systems deliver excellent layers for a variety of materials, including: aluminum alloys, platinum silicide, titanium-tungsten, NiCr-gold, silicon nitride, silicon dioxide, precious metals, and permalloy.
No single cathode design can meet all the requirements of different users or the diverse applications of a single user. Each layer material requires an optimal combination of target material, size, and shape for efficient production. Therefore, the SEMILINE series offers two different cathode configurations: 200 mm round and triangular targets.
configurable with up to four PK200 or triangular cathodes for DC, RF, bias, and reactive sputtering
clean high-vacuum system, reproducible results, and excellent uniformity with high yield
flexible system architecture, intelligent wafer handling, and control for high-throughput and development environments
San Francisco, CA, USA
The Moscone Center
Booth 2261
Shanghai, China
Shanghai New International Expo Center
N1 / 181
San Francisco, CA, USA
Moscone Center
North Hall | Booth 5373
